XZZ Xinzhizao L23 BGA Reballing Stencil Platform
Precision-engineered stainless steel stencil for flawless BGA reballing on iPhone A8-A16, MTK, EMMC, Qualcomm, and HUAWEI CPUs. Laser-cut apertures ensure perfect solder ball alignment, reducing bridging and misplacement. High-temperature resistant anodized aluminum base provides stability during repeated rework. Non-slip silicone feet keep the platform steady for intricate motherboard repairs. Ideal for professional microsoldering, chip replacement, and PCB repair in workshops or electronics labs. Compatible with most rework stations and hot air tools. Durable oxidation-resistant coating extends lifespan even under heavy daily use. Ultra-thin 0.15mm design allows precise solder paste application without smudging. Global wholesale pricing available for bulk orders—stock up your repair toolkit at unbeatable value. Ships worldwide with quality guaranteed.