Precision-engineered aluminum alloy frame ensures durability and heat resistance for long-term use in high-temperature soldering environments.

High-precision CNC machining guarantees perfect alignment and stability during delicate IC and CPU reballing procedures.

Multi-functional clamp design accommodates various smartphone motherboard sizes from 4" to 7" with adjustable tension control.

Non-slip silicone pads protect PCB surfaces while providing secure grip during component removal or BGA chip replacement.

Essential toolset for professional repair technicians handling SMD rework, chip-level repairs, and microsoldering in mobile device servicing.

Ultra-flat anodized platform prevents warping during thermal cycles, critical for maintaining solder joint integrity in reflow processes.

Includes modular accessories for GPU/CPU socket repairs, making it ideal for electronics workshops and microsoldering training centers.