Premium Black Steel BGA Reballing Stencil for iPhone Repair

High-precision laser-cut steel stencil ensures flawless BGA reballing on iPhone 13/12/11 Pro MAX/XS/XR/X/8/7/6/6S Plus CPUs. Ultra-durable 0.2mm thick steel plate resists warping for repeated use. Micro-holes maintain perfect solder ball alignment during chip-level repairs.

Essential tool for professional technicians tackling GPU/cpu rebelling, motherboard repairs, or microsoldering tasks. Compatible with lead-free solder paste and works seamlessly with hot air stations. Mirror-polished surface prevents solder sticking for effortless cleanup.

Wholesale-priced for bulk buyers – stock up your repair shop with industry-grade tools at unbeatable global rates. Ships worldwide with bulk order discounts. Trusted by electronics refurbishers and microsoldering specialists.