Professional-Grade Automatic BGA Rework Station – WDS-700
Precision-engineered for seamless IC reballing and chip removal, featuring high-accuracy infrared heating (up to 500°C) with 8-zone temperature control for distortion-free soldering. Industrial-grade stainless steel body with ceramic heating plates ensures durability and even heat distribution. Ideal for repairing smartphones, laptops, and gaming consoles—handles chips from 5mm² to 50mm², including QFN, BGA, and CSP. Advanced vacuum suction and auto-leveling PCB tray prevent component damage during rework. Plug-and-play setup with multilingual interface (supports English/Spanish/German). Includes anti-static tweezers and a 12-month warranty. Bulk discounts available—optimized for repair shops and electronics manufacturers.