Auto WDS620 BGA Welding Equipment – Precision & Efficiency for Professional Repairs
High-performance BGA rework station with advanced hot air technology for precise soldering and desoldering of BGA chips. Industrial-grade ceramic heating element ensures uniform heat distribution, preventing component damage. Digital temperature control (100–500°C) with ±2°C accuracy for delicate PCB repairs. Ergonomic design with anti-slip base and lightweight handpiece for prolonged use. Includes multiple nozzle sizes (5mm–20mm) for versatile applications—ideal for smartphones, laptops, and gaming consoles. Quick heating (≤30 sec) and auto-cooling system enhance workflow efficiency. Durable stainless steel body with heat-resistant insulation. Compatible with lead-free solder, meeting RoHS standards. Essential for electronics repair shops, manufacturing units, and DIY enthusiasts. Bulk pricing available for wholesale buyers—global shipping with guaranteed lowest rates.