High-Precision HDI Circuit Board for Advanced Electronics

Expertly crafted in Shenzhen with multi-layer design for superior signal integrity and impedance control. Ideal for high-performance mobile phone motherboards, IoT devices, and compact electronics requiring ultra-thin, high-density interconnects.

Premium FR-4 material with ENIG surface finish ensures corrosion resistance and stable soldering. Laser-drilled micro-vias enable complex routing without compromising durability.

Optimized for 5G/WiFi 6 applications with controlled dielectric constant (Dk 3.8-4.2). Supports 10/12-layer stacked via configurations for advanced chip packaging.

Direct factory pricing with MOQ flexibility for bulk PCB orders. Global logistics support for OEM/ODM manufacturers seeking reliable high-frequency boards.

Strict IPC Class 2/3 standards compliance. Custom impedance tolerance (±7%) and solder mask colors available. Lead-free RoHS certified for international shipments.

Typical applications:

- Smartphone mainboards

- RF modules

- Medical microelectronics

- Automotive control units