Precision-engineered layered desoldering platform with military-grade aluminum alloy construction for ultra-stable heat dissipation during iPhone motherboard repairs.

Multi-compatibility design fits iPhone X/XS/11 Pro Max/12 Pro CPU chip removal with three specialized CH5 variants (CH5/CH5-B/CH5-C) for different repair scenarios.

Micro-grooved surface texture ensures chip-level precision during glue removal operations, preventing accidental component damage common with standard desoldering tools.

Professional-grade anodized coating withstands repeated high-temperature cycles (up to 450°C) without surface degradation or thermal deformation.

Essential for microsoldering technicians performing board-level repairs, chip replacements, or data recovery operations in professional repair shops.

Weight-balanced ergonomic structure allows single-handed operation during prolonged repair sessions, reducing technician fatigue during delicate procedures.

Full CNC-machined body with tolerance under 0.01mm eliminates vibration transfer during precision work, critical for successful BGA reballing operations.