2019 Mobile Phone Motherboard 5860 – Premium BGA Rework Station
High-precision BGA rework station designed for professional-grade mobile phone motherboard repairs. Crafted with industrial-grade ceramic heating elements for uniform heat distribution and extended durability. Features advanced temperature control (0-500°C ±1°C) with real-time LCD display for pinpoint accuracy. Optimized for seamless IC chip replacement, soldering, and PCB rework. Ideal for smartphone repair shops, electronics manufacturers, and DIY enthusiasts. Compatible with most SMD components, ensuring versatile application. Built with anti-static aluminum alloy frame for stability and heat resistance. Includes ergonomic suction nozzle for safe component handling. Streamlines high-volume repairs with rapid heating and cooling cycles. Wholesale pricing available—bulk orders maximize cost efficiency. Global shipping with guaranteed lowest market rates. Upgrade your repair toolkit with professional-grade reliability.