Professional 1300W Smart Hot Air Desoldering Station for Precision PCB Repair
High-performance 1300W heating element ensures rapid temperature rise (3-5 seconds) with ±2°C accuracy for delicate BGA/SMD rework. Advanced PID temperature control and adjustable airflow (5-120L/min) prevent component damage. Durable ceramic heating core and anti-static design extend lifespan while protecting sensitive electronics. Ergonomic lightweight handle reduces fatigue during prolonged mobile phone or motherboard repairs. Smart features include auto sleep mode, temperature memory, and digital display for efficient workflow. Compatible with 852/853 nozzles—ideal for micro-soldering, IC replacement, and PCB rework in professional workshops. Industrial-grade build with overheat protection ensures safety during high-volume repairs. Ships with 5 stainless steel nozzles for versatile applications.