Precision-Crafted for iPhone Repairs
High-grade aluminum alloy base with micro-level flatness ensures stable reballing and soldering. CNC-machined slots perfectly fit iPhone 11-15 ProMax motherboards, eliminating misalignment during BGA work.
18-in-1 Multi-Functional Design
Interchangeable fixtures cover logic board clamping, backplate support, and heat dissipation. Includes dedicated stencils for IC recalibration, reducing tool clutter for repair shops and technicians.
Industrial-Grade Heat Resistance
Hardened steel brackets withstand 300°C+ soldering temperatures without warping. Non-slip silicone pads protect PCB surfaces from scratches during intensive rework sessions.
Optimized for High-Volume Repairs
Modular components enable rapid board swaps, ideal for bulk phone refurbishing lines. Anodized finish resists oxidation for long-term workshop use.
Ultimate Accuracy for Micro-Soldering
Laser-engraved alignment markers ensure ±0.1mm BGA placement precision. Compatible with all standard rework stations and hot air guns.
Wholesale Advantage
Direct factory pricing cuts middleman costs – stock up for your repair team or resell with profit margins intact. Bulk orders ship same-day from global warehouses.