Mechanic IX5 Ultra Universal Preheating Station
Precision layered heating platform ensures uniform temperature distribution for delicate phone motherboard repairs. High-quality aluminum alloy construction with advanced thermal conductive technology enhances durability and heat transfer efficiency. Dot matrix heating design allows targeted glue removal without damaging surrounding components. Adjustable temperature range (50°C-300°C) caters to various repair scenarios, from BGA rework to IC chip replacement. Universal compatibility supports most smartphones, tablets, and small electronics. Anti-slip silicone mat and safety auto-shutoff feature prevent overheating accidents. Ideal for professional repair shops, DIY enthusiasts, and electronics manufacturers requiring reliable, high-performance preheating solutions.