Precision iPhone Motherboard Layer Tester for Advanced Repairs
Ultra-thin multi-layer PCB design ensures accurate detection of short circuits, open circuits, and faulty components on iPhone X to 14 Pro Max motherboards. High-conductivity gold-plated probes minimize signal interference for reliable BGA testing. Durable aerospace-grade aluminum alloy frame with anti-slip silicone grips provides stability during intricate board-level diagnostics. Compatible with logic board repair stations and microsoldering workbenches. Integrated LED voltage indicator instantly identifies power distribution issues across 12-layer boards. Essential toolset for professional repair shops, microsoldering technicians, and mobile device engineering labs. Optimized probe spacing (0.2mm precision) targets iPhone-specific IC chips and ball grid arrays without damaging adjacent components. Includes replaceable ceramic-tip probes for long-term use in high-temperature environments. Backed by ISO-certified manufacturing with ESD-safe materials. Bulk orders available for repair center chains and vocational training institutes.