High-Quality Lead-Free Solder Paste for Precision PCB Repairs
Premium 158°C medium-temperature tin paste ensures smooth, reliable soldering for mobile phone PCBs, BGA chips, and SMD components. Formulated with high-purity lead-free alloy for safe, durable connections without toxic fumes. Ultra-fine particle size delivers exceptional flow and adhesion, minimizing bridging and cold joints. Ideal for delicate smartphone motherboard repairs, ensuring stable performance under thermal stress. Optimized viscosity prevents dripping, allowing precise application with stencils or syringes. Perfect for both professional technicians and DIY enthusiasts working on compact electronics. Bulk packaging available for high-volume repair shops and manufacturers. Trusted by industry experts for its consistent melting point and oxidation resistance.