Professional BGA Rework Station T862++ for Mobile Phone Motherboard Repair

Premium Industrial-Grade Build: High-precision CNC-machined aluminum alloy frame with advanced heat-resistant components ensures durability and stability during intensive rework sessions.

Advanced Temperature Control: Dual-zone independent heating system (200-480°C) with ±2°C accuracy, featuring auto-calibration for flawless BGA chip reballing and soldering.

Universal Compatibility: Supports 90% of smartphone motherboards (including iPhone, Samsung, Huawei) with 12 interchangeable nozzles for diverse IC sizes.

Smart Safety Features: Built-in overheating protection + ESD-safe design prevents circuit board damage during delicate repair procedures.

Workshop-Ready Performance: Ideal for microsoldering labs, device refurbishing centers, and electronics training institutes requiring high-volume motherboard repairs.

Includes OEM-certified China-made accessories: Desoldering tweezers, stencil kit, and flux injector included for immediate operation.