Mobile Welding Equipment WDS-700 BGA Rework Station
Precision-engineered for professional mobile phone motherboard repair with high-performance soldering capabilities. Features advanced temperature control (0-500°C) and dual heating zones for flawless BGA rework. Heavy-duty aluminum alloy body ensures durability, while ergonomic design enhances workspace efficiency. Ideal for repairing smartphones, tablets, and microelectronics with auto-solder calibration for zero-error results. Ultra-responsive touchscreen interface simplifies operation, and anti-static design protects sensitive components. Includes high-grade ceramic heating elements for rapid heat-up and stability. Perfect for repair shops, tech labs, and electronics manufacturing. Global wholesale pricing with bulk discounts—trusted by professionals worldwide for reliability and affordability.