Premium Layered Face Heating Technology for precision IC chip rework and desoldering

High-grade aluminum alloy heating platform ensures uniform heat distribution and rapid temperature recovery

Advanced PID temperature control system maintains accuracy within ±2°C for delicate component handling

Multi-application compatibility (N13/N11/N12/X3/M6 CPUs) with adjustable 0-500°C working range

Dual-layer insulated design with ceramic heating elements for extended tool lifespan

Industrial-grade silicone non-slip mat protects PCB surfaces during intricate repairs

Optimized airflow chamber prevents component overheating during prolonged operations

Essential for professional electronics repair shops and SMT production lines

Ideal for BGA reballing, chip replacement, and motherboard-level troubleshooting

Compact workstation design integrates seamlessly with existing repair bench setups

Ultra-responsive touch panel interface with real-time temperature monitoring

Includes magnetic tool holder and integrated cable management system

Certified CE/RoHS compliant for safe operation in commercial environments