Professional-Grade WDS-660 Infrared BGA Welding Machine for Precision Repairs
Ultra-precise infrared heating system ensures flawless reballing and rework for BGA chips on Samsung/iPhones. Industrial-grade ceramic heating elements deliver uniform temperature control (50°C–500°C) with ±2°C accuracy. Heavy-duty steel frame with shockproof design enhances durability for high-volume repair workshops. Includes a vacuum suction pen and anti-static tweezers for safe component handling. Optimized for micro-soldering tasks: ideal for motherboard repairs, GPU reflow, and chip replacement in smartphones/tablets. Patented dual-zone preheating prevents PCB warping. Comes with a 12-month warranty and 24/7 technical support. Bulk discounts available for repair shops and resellers.