Feature Listing for Seamark BGA Rework Station ZM-R5830

High-Precision BGA Welding
– Equipped with advanced infrared heating and precise temperature control for flawless BGA chip rework on laptops and phone motherboards.
Durable Industrial Build
– Heavy-duty steel frame with anti-slip base ensures stability during high-temperature operations.
Multi-Layer PCB Compatibility
– Supports 1- to 10-layer motherboards with adjustable nozzle sizes for diverse chip dimensions.
Rapid Heating & Cooling
– Dual-fan cooling system reduces downtime, while ceramic heating elements ensure uniform heat distribution.
Budget-Friendly Professional Tool
– Low-cost solution without compromising performance, ideal for repair shops and electronics workshops.
Easy Calibration & Safety
– Auto-leveling function and overheat protection prevent damage to sensitive components.
Wide Applications
– Perfect for repairing gaming consoles, smartphones, and industrial control boards with micro-soldering needs.
Global Wholesale Advantage
– Direct bulk pricing ensures unbeatable value for businesses and large-scale buyers.