Precision-engineered aluminum alloy base ensures superior heat conductivity for efficient chip glue removal

Advanced temperature control system (50°C-300°C adjustable) prevents motherboard damage during delicate repairs

Non-slip silicone mat with laser-etched positioning grooves secures iPhone 12/11/X series boards during operation

Dual-layer heat insulation design protects workbench surfaces while maintaining optimal operating temperature

Industrial-grade ceramic heating plate delivers even heat distribution for professional-grade motherboard repairs

Compact 180x120mm work area optimized for microsoldering stations and repair lab environments

Includes calibrated thermal sensor for real-time temperature monitoring (±2°C accuracy)

Reinforced steel frame construction withstands continuous commercial workshop use