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I have been satisfied with my merchandise and the receive time is good as well.
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LUOWEI LW-SP1 High quality Solder paste For Mobile Repair 138/158/183/217 Tin Paste Mobile Phone PCB Bga Motherboard SolderPaste
$6.4$8.01-20.1%
Tool type:
LW-SP1--138
LW-SP1--183
LW-SP1--158
LW-SP1--217
Quantity:
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Features
LUOWEI LW-SP1 High-Quality Solder Paste for Mobile Repair
Premium lead-free solder paste with fine 138/158/183/217 mesh size for precise PCB and BGA repairs. Ideal for mobile phone motherboard rework, offering smooth application and strong adhesion. High-purity tin alloy ensures reliable conductivity and corrosion resistance. Low-temperature melting point (138°C–217°C) prevents heat damage to delicate components. Perfect for professional technicians and DIY repairs—suitable for smartphones, tablets, and microelectronics. No-clean formula reduces post-soldering residue. Bulk packaging available for cost-effective large-scale repairs. Trusted by global repair shops for consistent performance.
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