LUOWEI LW-SP1 High-Quality Solder Paste for Mobile Repair
Premium lead-free solder paste with fine 138/158/183/217 mesh size for precise PCB and BGA repairs. Ideal for mobile phone motherboard rework, offering smooth application and strong adhesion. High-purity tin alloy ensures reliable conductivity and corrosion resistance. Low-temperature melting point (138°C–217°C) prevents heat damage to delicate components. Perfect for professional technicians and DIY repairs—suitable for smartphones, tablets, and microelectronics. No-clean formula reduces post-soldering residue. Bulk packaging available for cost-effective large-scale repairs. Trusted by global repair shops for consistent performance.