Premium 4-in-1 BGA Reballing Stencil for iPhone 12 Series

High-Precision Steel Alloy
– Crafted from durable, laser-cut stainless steel for flawless solder ball alignment, ensuring long-lasting performance and scratch resistance.
Multi-Model Compatibility
– Designed for iPhone 12/12 Pro Max/12 Mini, covering motherboard soldering, middle frame repair, and tin planting with a single tool.
Ultra-Thin 0.1mm Design
– Delivers pinpoint accuracy for BGA rework, minimizing solder bridging and maximizing reballing success rates.
Engineered for Efficiency
– Ideal for professional repair shops, microsoldering technicians, and DIY enthusiasts tackling logic board repairs or GPU reballing.
Global Bulk Supply Advantage
– Direct wholesale pricing ensures unbeatable value for high-volume buyers stocking repair tools.