Precision BGA Repair Platform for iPhone X-15 Series
High-grade aluminum alloy base ensures durability and heat dissipation for prolonged motherboard repair sessions. Laser-etched positioning marks guarantee millimeter-level accuracy during tin planting and BGA rework. Non-slip silicone pads protect delicate components while providing stable workstation grip. Optimized for micro-soldering tasks with interchangeable nozzle compatibility for various solder ball sizes (0.2-0.6mm). Anodized surface resists oxidation, maintaining conductivity across 10,000+ repair cycles. Includes magnetic jig adapters for swift iPhone model transitions (X to 15 series). Ideal for repair shops tackling logic board fractures, GPU reballing, or charging port replacements. Compatible with hot air stations and infrared preheaters for multilayer PCB heating. Ships with anti-static foam case for tool-free setup and organized accessory storage. Wholesale bulk pricing available for repair center chains and technical training institutes. OEM customization accepts logo engraving on tool-free adjustment knobs.