Precision-Engineered BGA Rework Nozzle Set for Professional-Grade Repairs
Ultra-durable brass nozzles with anti-oxidation coating ensure long-lasting heat resistance and stability, ideal for high-frequency rework tasks. Customizable sizing (21x21mm to 35x35mm) fits most BGA chips, including GPU, CPU, and motherboard components, with optional bespoke dimensions. Dual-top/bottom nozzle design enables simultaneous heating for efficient, bubble-free soldering and precise component alignment. Mirror-polished inner walls promote even airflow distribution, minimizing thermal shock to delicate PCBs during reballing or replacement. Compatible with major rework stations (e.g., Quick, ACHI), featuring quick-release connectors for tool-free swaps mid-job. Industrial-grade insulation handles 480°C continuous heat, outperforming generic ceramic alternatives in thermal recovery speed.
Core Use Cases:
- Electronics repair shops servicing gaming consoles/laptops - PCB manufacturers conducting batch rework - R&D labs prototyping or salvaging high-value chips