Precision-Crafted 14-in-1 Reballing Stencil Platform
High-grade stainless steel BGA stencil with laser-etched apertures for flawless solder ball alignment on iPhone X–13 Pro Max logic boards.
Multi-Model Versatility
Universal compatibility for 14 iPhone models, including XR/XS Max/11/12 series, reducing tool clutter in repair workshops.
Anti-Warping Rigid Design
1.5mm thickened middle layer with reinforced edges prevents flex during reballing, ensuring consistent pressure for professional-grade results.
Quick-Clip Fixture System
Tool-free spring-loaded clamps secure motherboards instantly, speeding up high-volume repairs for shops handling 50+ daily units.
Micro-Tolerance Engineering
±0.01mm precision-cut openings match OEM solder ball patterns, eliminating bridging in 0.3mm pitch ICs.
Industrial-Grade Durability
Sandblasted surface resists flux corrosion, rated for 10,000+ reflow cycles – ideal for heavy-duty repair centers.