Precision-engineered aluminum alloy platform ensures uniform heat distribution, critical for delicate iPhone X-15 motherboard repairs. Advanced temperature control system maintains stable 50-300°C range with ±2°C accuracy for safe IC chip rework. Laser-etched dot matrix grid provides millimeter-level positioning for BGA stencil alignment during soldering. Multi-layer thermal insulation design prevents heat damage to surrounding components during prolonged preheating sessions. Compatible with all iPhone generations from X to 15 for cross-model repair shop efficiency. Military-grade silicone heating elements deliver rapid 30-second warmup for high-volume repair workflows. Micro-textured non-slip surface securely holds motherboards during chip replacement procedures. Professional-grade tool trusted by microsoldering technicians for daily multilayer PCB reballing tasks.