Precision BGA Rework Station for Professional Motherboard Repair

Industrial-grade optical alignment system ensures micron-level accuracy during BGA chip replacement. Dual independent temperature zones with PID control enable precise heating up to 480°C (±2°C stability). CNC-machined aluminum alloy base with ceramic heating plates guarantees even heat distribution.

Infrared preheating bottom module prevents PCB warping during rework. Compatible with smartphones, tablets, and small electronics PCBs. High-clarity 3.5X magnification lens with adjustable LED ring light for flawless solder ball inspection.

Professional-grade ESD-safe construction meets ANSI/ESD S20.20 standards. Includes vacuum pickup tool and stainless steel stencil set. Ideal for repair shops, electronics manufacturers, and R&D labs requiring repeatable BGA rework results.

Wholesale pricing available for bulk orders - global shipping with customs clearance support. Complete with CE certification and 12-month warranty.