RELIFE RL-404 Low-Temperature Solder Paste – Premium Lead-Free Solution for Precision Electronics
High-performance lead-free solder paste with ultra-low 138°C melting point, ideal for delicate iPhone repairs and BGA/SMD rework. Formulated with premium alloy particles for superior wetting and adhesion, ensuring reliable connections on high-end motherboards and PCBs. Engineered for precision applications, its fine particle size guarantees smooth printing and minimal voiding. Perfect for heat-sensitive components, reducing thermal stress during reflow. Trusted by professionals for consistent results in microelectronics and industrial PCB assembly. Optimized for high-speed stencil printing, offering excellent shelf life and flux stability. Compatible with automated SMT processes, delivering flawless soldering every time. Elevate your repair and manufacturing workflow with industry-grade reliability.
Key Applications:
iPhone board repairs, BGA reballing, SMD component assembly, and high-density circuit board manufacturing.