Professional BGA Rework Machine for iPhone 7 Plus Motherboard Repair
Ultra-precise temperature control ensures flawless BGA rework, ideal for repairing iPhone 7 Plus motherboards with damaged or loose IC chips. High-quality ceramic heating elements deliver even heat distribution, preventing component warping. Durable stainless steel construction with anti-slip base enhances stability during intricate repairs. Compatible with various IC sizes, perfect for micro-soldering and reballing tasks in phone repair shops or electronics workshops. Advanced thermal sensors auto-adjust heat levels, reducing the risk of overheating sensitive components. Includes ergonomic tweezers for safe chip handling, designed for both beginners and experienced technicians. Fast heat-up time (under 60 seconds) boosts efficiency, making it a must-have for high-volume repair businesses. Compact and portable, ideal for on-site servicing or tight workspace setups. Trusted by global wholesalers—buy in bulk at unbeatable prices for consistent quality and reliability. Upgrade your repair toolkit with this industry-grade BGA rework machine today.