Easy Operate DH-G730 Mobile Phone BGA Rework Station Repair Machine
Precision-engineered with high-quality alloy heating elements for uniform heat distribution, ensuring flawless BGA reballing and chip replacement. Advanced PID temperature control delivers ±2°C accuracy, preventing overheating damage to sensitive PCBs. Dual-zone infrared preheating (up to 300°C) combined with a 1200W main heater eliminates board warping, ideal for repairing smartphones, tablets, and gaming consoles. Ergonomic steel-frame design with quick-release nozzles streamlines high-volume repair workflows. Includes anti-static tweezers and stainless steel stencils for seamless rework on micro-BGA and QFN components. Trusted by professional repair shops and electronics manufacturers for its industrial-grade durability and one-touch calibration. Global wholesale pricing—order bulk quantities with guaranteed lowest rates. Ships worldwide with OEM-compatible spare parts support.