DH-5880 Micro BGA Rework Station
Precision-engineered with high-quality ceramic heating elements for uniform heat distribution and rapid thermal recovery. Features adjustable airflow control and digital temperature calibration (100-500°C) for seamless micro-BGA rework. Industrial-grade stainless steel nozzle ensures durability, while ergonomic handle design reduces operator fatigue during prolonged PCB repairs. Compatible with lead-free soldering processes. Ideal for electronics manufacturers, repair shops, and R&D labs handling smartphones, gaming consoles, and IoT devices. Supports high-volume rework with consistent performance. Global wholesale pricing with bulk discounts—lowest online rates guaranteed. Ships worldwide with seamless logistics.