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YCS Tin-planting Arc Pad Mobile Phone Motherboard CPU NAND IC Chip BGA Reballing Resistant High Temperature Magnetic Repair Mat

Name: YCS Tin-planting Arc Pad Mobile Phone Motherboard CPU NAND IC Chip BGA Reballing Resistant High Temperature Magnetic Repair Mat
Brand: OKwishing
SKU: 4005249266
Price: 9.3 USD
Availability: InStock
Rating: 5 (3 reviews)

$9.3
$11.87
-21.65%

Compatible Model:

Universal

Quantity:

Add to Cart

Wishlist

Features

Premium YCS Tin-Planting Arc Pad for BGA Reballing & Repair
High-temperature resistant magnetic mat ensures stable positioning during precision soldering. Made with durable tin-planting alloy for superior heat dissipation and anti-static performance. Ideal for mobile phone motherboard repair, CPU/NAND IC chip rework, and BGA reballing. Reinforced edges prevent warping under extreme heat (up to 450°C). Non-slip silicone base with strong magnetic hold keeps components secure. Compact, lightweight design fits any workspace. Trusted by professionals for flawless soldering results. Bulk orders available at unbeatable wholesale prices. Upgrade your repair toolkit today.

Shop globally at your fingertips! The more you buy, the richer you get!

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YCS Tin-planting Arc Pad Mobile Phone Motherboard CPU NAND IC Chip BGA Reballing Resistant High Temperature Magnetic Repair Mat

$9.3
$11.87
-21.65%

Features

Description

Shipping & Delivery

Features

Description

Shipping & Delivery

Shop globally at your fingertips! The more you buy, the richer you get!

Categories

YCS Tin-planting Arc Pad Mobile Phone Motherboard CPU NAND IC Chip BGA Reballing Resistant High Temperature Magnetic Repair Mat

$9.3$11.87-21.65%

Features

Description

Shipping & Delivery

Features

Description

Shipping & Delivery

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