High-Precision 3D BGA Reballing Stencil Kit
Exclusively designed for iPhone X~15 Pro Max motherboard repairs, featuring laser-cut 22-in-1 stainless steel templates with 0.1mm tolerance for flawless solder ball alignment.
Durable Plant Tin Platform
Industrial-grade tin-coated base ensures heat resistance up to 300°C, preventing warping during repeated BGA rework sessions.
Multi-Layer Board Compatibility
Precisely engineered middle layer alignment for X-ray-free repairs on logic boards, flex cables, and power IC components.
Professional Repair Solution
Essential for microsoldering labs, device refurbishers, and component-level technicians handling water damage or chip replacement cases.
Bulk Purchase Advantage
Wholesale-priced kits shipped globally with OEM-level quality assurance, ideal for repair shop inventory or training centers.