FORWARD FW-HA02 Precision Desoldering Station with Helical Wind Technology
Advanced helical wind design ensures precise, concentrated airflow for flawless solder removal without damaging components. High-accuracy temperature control (100°C–480°C) with rapid heating for efficient PCB and motherboard repairs. Premium ceramic heating element paired with industrial-grade aluminum alloy nozzle for durability and heat resistance. Anti-static design protects sensitive electronics during mobile phone or microchip repairs. Ideal for professional technicians, electronics workshops, and DIY enthusiasts handling SMD components, IC chips, or circuit board rework. Compact yet powerful, featuring adjustable airflow and ergonomic grip for prolonged use. Direct wholesale pricing with bulk discounts—global logistics support for large orders.