Professional BGA Rework Station for Precision Repairs
High-precision temperature control with advanced PID technology ensures stable heating for delicate IC chips and graphic cards. Industrial-grade aluminum alloy construction with ceramic heating plates provides superior heat distribution and durability. Ideal for reballing, reworking, and soldering BGA components on mobile phones, laptops, and gaming consoles. Equipped with a high-speed infrared preheater to minimize thermal stress on sensitive PCBs. Large work area accommodates multiple device sizes, from smartphones to high-end GPUs. User-friendly digital interface with customizable presets for efficient repair workflows. Anti-static design protects sensitive electronics during prolonged repair sessions. Trusted by repair shops and tech professionals for reliable, repeatable results.