WDS-700 BGA Rework Station – Precision Repair Solution for Mobile Phone Motherboards
High-precision temperature control ensures flawless BGA reballing and chip replacement, ideal for repairing smartphones, tablets, and microelectronics. Industrial-grade ceramic heating elements deliver rapid, even heat distribution, preventing PCB warping while maintaining component integrity. Advanced infrared preheating with dual-zone calibration eliminates cold spots, crucial for delicate motherboard repairs in professional workshops. Ergonomic modular design features adjustable nozzles and magnifying lens, streamlining intricate SMD component soldering and alignment. Built-in smoke filtration system with activated carbon ensures clean airflow, meeting strict workshop safety standards. Compatible with 99% of mobile phone motherboard layouts, supporting repairs from iPhone to Android devices. Full aluminum alloy construction with anti-slip base enhances durability for high-frequency commercial use. Includes precision tweezers, stencils, and solder paste trays—ready for immediate deployment in repair labs or small-scale production. Ultra-responsive touchscreen interface simplifies temperature and airflow adjustments, reducing operator training time.