Magic Tag Dot Repairing Soldering Lug Spot Pad for iPhone Welding Board Replacement Motherboard IC Repair
Ultra-precise copper alloy base ensures superior conductivity and heat dissipation, ideal for delicate iPhone motherboard repairs. High-temperature resistant coating prevents oxidation, extending durability for repeated use. Laser-cut edges guarantee perfect alignment during IC chip rework or solder pad restoration. Compact design fits tight spaces on logic boards, perfect for micro-soldering tasks on iPhone X-14 series. Pre-tinned surface enables instant solder adhesion without flux residue. Individually tested for consistent thickness (0.2mm ±0.01) to avoid bridging or cold joints. Essential for professionals repairing water-damaged devices, replacing BGA chips, or jump-starting broken traces. Bulk packaging available for repair shops needing high-volume inventory at unbeatable wholesale pricing.