Professional BGA Rework Station with Precision Temperature Control
High-performance WDS-580 BGA rework station featuring advanced temperature curve setting for precise chip-level repairs. Industrial-grade ceramic heating elements ensure fast, uniform heat distribution, preventing PCB damage. Dual-zone IR preheating minimizes thermal stress on sensitive components. Digital PID control maintains ±1°C accuracy for flawless BGA reballing and SMD rework. Compatible with lead-free soldering processes. Ideal for electronics manufacturers, repair shops, and R&D labs. Heavy-duty steel construction with ergonomic nozzle design enhances durability. Includes multiple nozzle sizes for smartphones, laptops, and gaming consoles. Direct factory pricing with bulk discounts. Global shipping with warranty support. Upgrade your repair toolkit with this commercial-grade solution.