High-Precision BGA Machine for Professional Motherboard CPU Reballing

Industrial-grade steel frame with anti-vibration design ensures stability during high-temperature operations. Advanced infrared heating system offers precise temperature control (0.1°C accuracy) for flawless solder ball reflow.

Dual-zone heating technology prevents PCB warping, compatible with chips ranging from 10x10mm to 50x50mm. Includes nitrogen gas port for oxidation-free soldering in sensitive repairs.

Ideal for electronics manufacturers, repair shops, and R&D labs handling BGA chips on laptops, gaming consoles, and server motherboards. Modular nozzle kit supports all mainstream chip sizes and lead-free solder.

Built-in auto-calibration and multilingual interface streamline workflow. Military-grade wiring harness and German ceramic heating elements guarantee 50,000+ cycles. Thermal safety cut-off and real-time error diagnostics included.

Global wholesale pricing with bulk discounts for OEM/ODM partners. Ships with calibration weights, K-type thermocouple, and 24-month warranty.