RELIFE RL-044 HW Series CPU Integrated Steel Stencil Set – Premium Mobile Phone Repair Tool
High-precision 16-piece steel stencil set for flawless BGA reballing and CPU/GPU repairs. Made from durable stainless steel with laser-etched markings for ultra-accurate solder ball alignment. Hardened steel construction resists warping under high temperatures, ensuring long-term reliability. Mirror-polished surface prevents solder sticking for effortless cleanup. Ideal for professional technicians repairing smartphones, tablets, and gaming consoles. Compatible with主流芯片尺寸, including Snapdragon and MediaTek processors. Pre-cut apertures guarantee uniform solder paste application, minimizing rework. Includes protective case for organized storage and portability. Engineered for high-volume repair shops – withstands daily industrial use. Bulk pricing available for wholesalers and repair centers. Global wholesale supplier advantage: factory-direct pricing, bulk discounts, and fast international shipping. Upgrade your repair toolkit with commercial-grade precision.