China Professional Multi-Layer HDI Precision Impedance Board
Ultra-thin multi-layer HDI design ensures superior signal integrity and miniaturization for compact electronics. Precision impedance control (±5%) guarantees stable high-frequency performance in 5G and IoT applications. High-Tg laminate material enhances thermal resistance (up to 180°C), ideal for prolonged heavy-duty use. Laser-drilled micro-vias (0.1mm) enable dense interconnects, perfect for smartphones, wearables, and aerospace PCBs. ENIG surface finish provides oxidation resistance and smooth soldering. Customizable stack-up (8-20 layers) supports complex IC integration. RoHS-compliant, lead-free fabrication meets global safety standards. Bulk order discounts available for OEM/ODM partners. Fast prototyping (5-day turnaround) and mass production scalability.