High-Performance 12.0W/MK Thermal Gap Filler Pad for PCB & LED Cooling

Premium silicone-based thermal pad with ultra-high 12.0W/mK conductivity for rapid heat dissipation. Precision-milled to 0.5mm~5mm thickness options with ±0.1mm tolerance for flawless component contact.

Non-curing, non-pump-out formula maintains long-term stability under -40°C to 200°C. Reinforced ceramic/aluminum hybrid filler prevents tearing during installation.

Ideal for high-power PCB hotspots, LED arrays, automotive electronics, and 5G base stations. Self-adhesive layer simplifies assembly without thermal paste mess.

Factory-direct pricing with bulk discounts for industrial buyers. ISO-certified manufacturing ensures batch-to-batch consistency.