Powerful 1300W Heating System
Precision-engineered ceramic heating element delivers rapid heat-up (reaching 500°C in seconds) with stable airflow for consistent soldering performance.
Professional-Grade BGA Rework
Industrial-grade stainless steel nozzle (multiple sizes included) ensures even heat distribution for safe IC/BGA chip removal on motherboards and delicate PCB repairs.
Ergonomic Anti-Slip Design
Lightweight body (under 800g) with textured rubber grip reduces hand fatigue during prolonged phone/electronics repair sessions.
Smart Dual-Digital Display
Real-time temperature (±1°C accuracy) and airflow speed monitoring via backlit LCD for error-free microsoldering.
Multi-Scene Application
Ideal for smartphone screen replacements, game console repairs, automotive ECU debugging, and DIY circuit board projects.
Commercial Durability
Military-grade fiberglass insulation and copper-alloy internal wiring withstand 10,000+ hours of continuous operation in workshop environments.
Global Voltage Compatible
Universal 100V-240V input with surge protection for safe use in repair shops worldwide.
Tool-Free Nozzle Swap
Magnetic nozzle attachment system allows instant changes between precision (4mm) and wide-area (10mm) heating without cool-down waits.