WDS620 BGA Rework Station – Precision Repair for Professionals

Industrial-Grade Heating System
Equipped with advanced infrared heating technology for uniform temperature distribution, ensuring safe IC and GPU removal without damaging delicate motherboard circuits.
High-Precision Desoldering
Features a digital temperature control (100°C to 500°C) with rapid heat-up, ideal for reworking BGA chips on smartphones, laptops, and gaming consoles.
Durable Ergonomic Design
Stainless steel nozzle and ceramic heating elements resist corrosion, while the lightweight handle reduces fatigue during prolonged repair sessions.
Multi-Device Compatibility
Optimized for repairing mobile phones, laptops, and PCB boards, supporting high-density solder joints on modern GPUs and CPUs.
Commercial-Grade Efficiency
Trusted by repair shops and factories for fast, repeatable results—minimizes rework errors for bulk electronics restoration.
Global Wholesale Advantage
Direct factory pricing with bulk discounts—lowest cost guaranteed for high-volume buyers.
Note:
Includes international voltage compatibility (110V-240V).