Universal Preheating Station with Layered Heating for Phone Motherboard Repair

Precision-engineered aluminum alloy heating platform ensures even heat distribution for safe glue removal. Multi-layer dot matrix design prevents overheating damage to delicate components.

Advanced temperature control system maintains stable heat between 100-300°C for various repair scenarios. Ideal for smartphone motherboard rework, BGA chip replacement, and adhesive softening.

Industrial-grade silicone thermal pad included for enhanced heat transfer and component protection. Compact footprint fits perfectly in repair workshops and microsoldering stations.

Dual safety features include automatic power-off and overheat protection. Compatible with all major phone brands and motherboard sizes for universal repair applications.

Optimized surface texture prevents device slippage during delicate procedures. Essential tool for professional technicians performing precision electronics refurbishment.