High-Quality M11 Lead-Free/Low-Temperature Solder Paste for Precision Repairs
Premium 138°C low-melting-point alloy ensures safe, efficient BGA reballing without damaging sensitive components. Ideal for phone motherboard repairs, PCB rework, and delicate soldering tasks. Contains 50g of finely ground, lead-free paste with superior adhesion and smooth flow properties. Perfect for flying wire connections, reducing bridging risks in tight spaces. Optimized for high-precision applications, offering reliable performance in smartphone, tablet, and electronics repair workshops. Ensures minimal residue for cleaner post-soldering results. Globally sourced materials meet industry standards, backed by bulk pricing for cost-effective professional use. Trusted by technicians for consistent, high-yield results.