BGA Rework Station – Professional Mobile Repair Solution
Precision-engineered BGA rework station for seamless mobile and motherboard repairs, featuring industrial-grade ceramic heating elements for uniform temperature distribution. High-quality stainless steel construction ensures durability, while the advanced infrared preheating system prevents PCB warping. Ideal for repairing smartphones, tablets, and laptops—perfect for micro-soldering, LCD replacements, and BGA chip reballing. The adjustable airflow control and digital temperature settings guarantee accuracy for delicate components. Competitively priced for bulk buyers, this machine offers unmatched value for repair shops and electronics manufacturers. Optimize your workflow with this reliable, high-performance tool—engineered for precision and built to last.