Auto Alignment Inspection WDS-650 BGA Welding Equipment – Precision Motherboard Repair System
Ultra-precise auto-alignment technology ensures flawless BGA chip placement with micron-level accuracy, minimizing soldering defects. High-grade ceramic heating elements deliver uniform heat distribution (up to 500°C) for damage-free rework on delicate PCBs. Industrial-grade steel frame with anti-vibration design stabilizes components during high-precision repairs, ideal for laptops, gaming consoles, and telecom hardware. Intelligent thermal sensors prevent overheating, extending device lifespan. Multi-zone IR preheating (adjustable 100–300°C) eliminates board warping, perfect for multilayer motherboard repairs. Includes vacuum suction tool for safe handling of microchips. Plug-and-play setup with multilingual interface, trusted by professional repair shops and electronics manufacturers. Bulk order discounts available for wholesale buyers.