Premium Medium Temperature Solder Paste for Precision Electronics Repair
High-performance Sn63Pb37 alloy ensures optimal melting point (183°C) for safe, reliable bonding without damaging sensitive components. Ideal for BGA reballing, mobile phone chip repair, and motherboard component soldering with superior flow and adhesion. Fine particle size (25-45μm) enables precise application, minimizing bridging and voids for flawless joints. Industry-grade flux formulation reduces oxidation, enhancing wetting and long-term solder joint durability. Trusted by professionals for high-volume PCB assembly and intricate SMT rework—consistent results batch after batch. Bulk pricing available for workshops and manufacturers seeking cost-effective, high-quality solutions.