High-Precision ZM-7220A Mobile Phone & Laptop Motherboard Repair Machine with Reball IC Tools
Ultra-durable aluminum alloy frame with industrial-grade heating elements for consistent temperature control (50–450°C). Advanced ceramic heating plate ensures even heat distribution, preventing PCB warping. Integrated vacuum suction and precision nozzle for seamless BGA reballing and IC replacement. Compatible with smartphones, tablets, and laptops—ideal for microsoldering and chip-level repairs. Tool-free air pressure adjustment with ergonomic grip for steady handling. Includes anti-static tweezers and high-temp Kapton tape for delicate component protection. Full-kit solution for repair shops and tech professionals—boost efficiency with rapid heat-up (under 30 sec) and auto-cooling safety shutoff. Lowest bulk pricing globally—wholesale-ready with OEM-grade reliability.