Accurate Tin Ball High-Speed BGA Reballing Automatic Laser Soldering Machine
Precision-engineered for high-speed BGA reballing with laser accuracy, ensuring flawless solder joints for delicate laptop motherboards and mobile phone repairs. Features an automatic tin ball placement system for consistent, error-free reballing, reducing manual labor and increasing efficiency. Constructed with industrial-grade aluminum alloy for durability and heat resistance, paired with a high-precision laser soldering head for micron-level control. Ideal for professional repair shops, electronics manufacturers, and R&D labs requiring rapid, reliable PCB rework. Equipped with intelligent temperature calibration and real-time monitoring, preventing overheating damage to sensitive components. Supports a wide range of BGA chip sizes, making it versatile for smartphones, tablets, and high-end computing devices. Optimized for bulk processing with minimal downtime, backed by a robust cooling system for extended operation. Combines advanced automation with user-friendly controls, streamlining complex repairs into a one-touch operation. Upgrade your repair toolkit with industry-leading speed and accuracy.